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Toray Industries Achieves New Breakthrough In Polyimide, Expected To Go Into Mass Production Next Year!

2025-12-19 18:55:46

On December 18, Toray Industries, Inc. announced a significant announcement regarding the development of a negative photoresist polyimide film for next-generation semiconductor glass core substrates.New MaterialsThe simultaneous completion of Redistribution Layer (RDL) microfabrication and Through-Glass Via (TGV) electrode resin filling can not only significantly shorten the semiconductor manufacturing process but also considerably reduce costs. Currently, sample evaluation has commenced, with mass production planned to begin in April 2026.

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