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The Global Corrugated Summit - Lightening the Future is about to be held in Shanghai, exploring global trends and innovations in packaging lightweighting!
PACKCON Packaging Containers Exhibition 2025-03-28 09:29:04

 

As a brilliant gem in the international packaging industry, WEPACK 2025 has always been a major event in the global packaging field with its excellent international positioning. The Global Corrugated Summit (WCF), as WEPACK's international flagship project, has successfully led industry trends for three years since its debut in 2019, and now the fourth edition is about to unfold its glorious chapter.

This year, the Global Corrugated Summit will once again gather worldwide attention. Under the theme of "Lightweighting the Future," it will bring together over 300 industry leaders from 30 countries to engage in in-depth discussions on corrugated packaging, printing, packaging products, and end applications. The summit will explore global trends and innovations in packaging lightweighting, share cutting-edge technologies, and provide insights into market trends, offering a truly global, high-caliber industry event.

 

Basic Meeting Information

等活动日期:April 7, 2025 13:00-18:30

◾ Venue: Sheraton Shanghai Pudong Hotel (2nd Floor Banquet Hall)

Specific address: No. 38, Pujian Road, Pudong New District, Shanghai

◾ Organizer: Reed Exhibitions Group

◾ Event scale: 300 attendees

◾ Target Audience: Over 300 industry leaders from more than 30 countries, including representatives from industry associations, media, experts, packaging manufacturers, and equipment and material suppliers, will gather for the first global top-tier networking event in 2025!

 

Meeting Agenda

13:00 - 13:15

Opening Ceremony

Welcome address by Reed Exhibitions China

13:15 - 13:30

● Theme Speech: Sharing of Global Economic Trends

Speaker: Kiran Patel | Senior Director of the China-Britain Business Council

13:30 - 13:45

● Theme Speech: Packaging Lightweighting from a Global Perspective

Speaker: Stefano Paolo Bunag, Board Member of the World Packaging Organization (WPO)

13:45 - 14:15

● Theme Speech: Packaging Lightweighting from a Chinese Perspective

Speaker: China Packaging Federation

14:15 - 14:45

● Tea Break and Networking Time

14:45 - 15:15

● Keynote Speech: Challenges and Opportunities in Packaging Lightweighting in Latin America

Speaker: Mariano Saludjian, Secretary General of the Argentine Corrugated Cardboard Manufacturers Association (CAFCCO)

15:15 - 15:45

● Keynote Speech: Lightweight Transformation of the Asian Corrugated Box Industry

Speaker: Varna Sudasna, Director of the Asian Corrugated Carton Association (ACCA)

15:45 - 16:05

● Keynote Speech: The Sustainable Development Path of India's Corrugated Box Industry

Speaker: Manohar Lal Agarwal, former president of the Indian Corrugated Box Manufacturers Association (FCBM) and vice president of the International Corrugated Case Association (ICCA)

16:05 - 16:25

● Theme Speech: Sustainability and Packaging Lightweighting in the Indian Printing Industry

Speaker: Ashwani Gupta, President of the All India Federation of Printers and Packers

16:25 - 16:45

"From Concept to Reality: Philips' Journey Towards Lightweight Packaging"

Speaker: Johnny Xu, Senior Packaging Technology Manager/Expert, Signify

 

16:45 - 17:10

Roundtable Discussion: Packaging Lightweight from a Global Perspective

Host:

Varna Sudasna, Director of the Asian Corrugated Case Association (ACCA)

 

Participants:

  • Mariano Saludjian, President of the Argentine Corrugated Cardboard Manufacturers Association (CAFCCO)

  • Stefano Paolo Bunag, Board Member of the World Packaging Organisation (WPO)

  • Xu Chengyong, packaging design expert

     

Main content:

Global industry leaders will delve into the global trends, technological innovations, policy support, and market opportunities in lightweight packaging.

17:10 - 17:15

● Closing Speech: Future Prospects of Lightweight Packaging

 

17:15 - 18:00

Cocktail party

 

*There is simultaneous interpretation on site.

* Final agenda is subject to on-site arrangements

 

 

Selected end-user brands and media representatives

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* The above ranking is not in any particular order.

 

 

Review of Previous Summits

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● ● ● ● ● ●

Not only the Global Corrugated Summit – Light Up the Future (April 7th · Sheraton Grand Shanghai Pudong Hotel), but there will also be more exciting events at the 2025 China International Corrugated Exhibition (April 8-10th · Shanghai New International Expo Center)! High-end industry forums, TAP business matchmaking, and the global/Asian/Chinese debut of new equipment and products… Here, witness the industry's creativity, gain insights into its development potential, and foresee the future of the corrugated packaging industry.

 

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Editor | Cardboard Box Micro World
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·Booth Reservation·

 

Mr. Lu Yao
021-2231 7103

adward.lu@rxglobal.com

 

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WEPACK World Packaging Industry Expo (World Expo of Packaging Industry) is a global super event covering the entire packaging industry chain, with forward-thinking, pioneering, and influential characteristics. It is organized by Reed Exhibitions and conducted in strategic cooperation with WPO (World Packaging Organization). The exhibition includes seven major themed exhibitions: 2025 China International Corrugated Exposition, 2025 China International Flexible Packaging Exposition, 2025 China International Packaging Containers Exposition, 2025 Shanghai International Paper Exposition, 2025 Shanghai International Digital Printing Technology Exposition, 2025 Shanghai International New Label Technology Exposition, and 2025 Plant Fiber and Food Packaging Manufacturing Technology Exposition. The scale of the exhibition continues to expand, and the variety of exhibits keeps growing richer.
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