Shengquan group expands into 17 types of specialty polymer materials

After the AI and industry boom, many polymer materials have encountered significant opportunities, and many companies are "quietly making a fortune," such as Dongcai and Shengquan.

In the semi-annual report, Shengquan stated that the net profit for the first half of the year increased by 51.19% year-on-year, mainly driven by industries such as AI computing power construction, high-frequency communication, and new energy vehicles, especially...Benefiting from the surge in global AI server demand, the company, as a key supplier of chip packaging and server PCB materials, is experiencing a boom in PPO resin demand.

Keep chasing the wind, [DT New Materials]It has been learned that recently, the Jinan Municipal Bureau of Ecology and Environment has released...Shandong Shengquan New Materials Co., Ltd. Kiloton-scale High-performance Resin Pilot ProjectThe public announcement of the acceptance of the Environmental Impact Report, further increasing efforts in specialty high polymer materials.

It is reported that the project covers an area of 24,296.6 square meters, with a total investment of 123.59 million yuan. The project includes a total of 17 pilot-scale research and development lines, with a total pilot-scale capacity of 2,027 tons per year. It is expected to be put into operation in December 2026, with a pilot period of three years, mainly consisting of:

100 tons/year pressurized phenolic solid resin pilot R&D line.

100 tons/year atmospheric pressure phenolic solid resin pilot R&D line.

60 tons/year thermosetting phenolic solid resin pilot R&D line.

500 tons/year pilot research and development line for phenolic liquid resin (including a 300 tons/year pilot R&D line for etherified phenolic resin and a 200 tons/year pilot R&D line for etherified amino resin).

600 tons/year phenol-modified amine resin pilot production line.

60 tons/year electronic-grade phenolic resin pilot R&D line (including 24 tons/year electronic-grade solid phenolic resin pilot R&D line and 36 tons/year electronic-grade solvent-based phenolic resin pilot R&D line);

60 tons/year pilot production line for low dielectric hydrocarbon resin.

10 tons/year pilot-scale research and development line for bisnaphthol formaldehyde resin.

5-ton/year pilot R&D line for low dielectric active ester.

60-ton/year pilot research and development line for phosphorus-containing active ester resin.

150 tons/year pilot production line for high-viscosity thermosetting resin.

12 tons/year phthalonitrile resin pilot research and development line;

A pilot research and development line for casting binders with a capacity of 300 tons per year (including a 200-ton per year pilot R&D line for special furan resin and a 100-ton per year pilot R&D line for alkyd resin).

10-ton/year pilot research and development line for trifunctional epoxy resin.

Special Electronic ResinIt is a compound with excellent heat resistance, compatibility, dielectric properties, moisture and heat resistance, and thermal stability, including hydrocarbon resins and imide substances. It is an important raw material for PCB (Printed Circuit Board), acting as a filler to bond and enhance the performance of the board. With the continuous development of 5G/6G and AI, the demand for high-performance PCBs in electronic devices is constantly increasing.

Considering both its own resin research and development experience and market opportunities, Shengquan New Materials has successfully completed pilot tests for various high-performance resins. This project aims to conduct scale-up verification in order to expedite the industrialization of research results. The materials involved in this project are briefly described as follows:

Phenolic resin:Compression-molded phenolic solid resin and atmospheric phenolic solid resinThey all belong to the category of thermosetting phenolic resins, with the difference lying in the synthesis pressure conditions. Their performance is characterized by excellent heat resistance, high char yield, and good mechanical strength. After curing, they can form a stable three-dimensional network structure but are relatively brittle in texture. They are primarily applied in fields with extremely high requirements for heat resistance and flame retardancy, such as friction materials (brake pads, clutch discs), refractory materials (magnesia-carbon brick binders), and abrasives (grinding wheels).

Phenolic liquid resin: Especially the varieties modified by etherification, have good water solubility or alcohol solubility, storage stability, and flexibility. Etherified phenolic resins are commonly used as foundry coatings, wood adhesives, and tackifiers for tire rubber.Etherified amino resinThe main use is as an adhesive for wood processing and a cross-linking agent for coatings, which can effectively reduce formaldehyde emissions.

Aminated phenolic resin:A special epoxy resin curing agent derived from the modification of amines with natural phenols such as cardanol not only possesses the heat resistance of phenolic resins but also has the unique advantage of rapid curing in low-temperature and humid environments. It is widely used in epoxy flooring, marine anti-corrosion coatings, and adhesives.

Biphenol formaldehyde resinIt has the characteristics of high molecular rigidity, high heat resistance, and good mechanical strength. It is mainly used as a synthetic intermediate for high-performance engineering plastics (such as polyarylate), a dye dispersant, and a precursor for high-temperature resistant materials.

Compared to ordinary phenolic resin,Electronic-grade phenolic resinThe requirements for technology are higher, resulting in lower free phenol in the finished product, better heat resistance, and a higher Tg when fully cured, with a high thermal decomposition temperature as well. Electronic-grade phenolic resin has high purity, a linear structure, and excellent physical and chemical properties, which can meet the high demands of electronic components for materials. The demand is large and there is still considerable room for development, but there is a significant reliance on imports.

The main domestic phenolic resin manufacturers currently include Shengquan Group, Hangmo Group, Yushiju Chemical, Tongcheng New Materials, Southeast Plastics, Taier Chemical, Laiwu Runda New Materials, Yingkou Runda New Materials, Ouzone, Kolon Chemical, Silector, Juneng Refractory, Bonde Chemical, Zeta Chemical, and others.

Low-dielectric hydrocarbon resin:Hydrocarbon resins exhibit low dielectric constants and ultra-low dielectric loss factors over a wide range of frequencies and temperatures due to the low electronic polarizability of C-C and C-H bonds. Additionally, hydrocarbon resins have excellent processing performance and, compared to other high-frequency copper-clad laminate resin materials, they offer simple molding processes and low costs. They are considered to be the next generation of high-frequency and high-speed copper-clad laminates, especially...The preferred resin material for high-frequency copper clad laminate.Leading domestic companies such as Guangdong Shengyi Technology, Huazheng New Material, and Zhongying Technology have achieved large-scale industrialization.

Low-dielectric active esterLow-dielectric active esters are the new generation.High-performance epoxy resin curing agentIt endows the cured material with extremely low dielectric loss, high heat resistance, and low water absorption, making it suitable for manufacturing copper-clad laminates used in high-speed and high-frequency communications. The technology has a high threshold, and leading domestic companies such as Tongcheng New Materials and Shengyi Technology are actively engaging in research and production.

Phosphorus-containing active ester resin.The introduction of phosphorus into the molecules of low-dielectric active esters is a key material for achieving "halogen-free" copper-clad laminates used in high-end servers and base stations.

High-viscosity thermosetting resin:High-viscosity thermosetting resin refers to a thermosetting resin with extremely high viscosity before curing. This characteristic allows it to fully penetrate and firmly bond with abrasive tools (such as high-performance grinding wheels) and fillers in friction materials. Jinan Shengquan Group and Qingdao Sanli Chemical are important suppliers.

Phthalonitrile resin.As an excellent new type of thermosetting resin material, due to its molecular structure being rich in aromatic rings and cyano groups, this resin possesses good high-temperature resistance, as well as excellent dielectric and mechanical properties. It has broad application prospects in fields such as aerospace, national defense and military industry, integrated circuits, automotive industry, and wind turbine blades. Currently, it is still in the research and trial production stages domestically.

Casting binders (special furan resin, alkyd resin):Furan resin is the core material for making casting molds. Due to its high strength and good collapsibility, special furan resin is widely used in sand casting of cast iron and cast steel. The furan phenolic resin binder system used in the cold box process can achieve extremely high core-making efficiency. Jinan Shengquan Group and Suzhou Xingye Materials are the leading companies in the domestic market in this field.

Tri-functional epoxy resinTrifunctional epoxy resin has a higher crosslinking density compared to ordinary bisphenol A type epoxy, thus exhibiting higher glass transition temperature, thermal stability, mechanical strength, and chemical resistance after curing. It is mainly used for high-performance carbon fiber composites, electronic packaging, and high-end anti-corrosion coatings. Major domestic producers include Huayi Group, Anhui Xinyuan Technology, and Hongchang Electronics.