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Asahi kasei duraflex™: Low Viscosity Curing Agent Enhances Thermal Management Material Performance

Ruijie Consulting 2025-10-22 17:47:30

Thermal issues, industry consensus

The rapid development of new energy vehicles, 5G communication devices, and AI servers has driven the miniaturization and high integration of electronic components.The resulting heat generation issue has become a core challenge restricting performance and lifespan.

Especially inGap filler thermal materialThe demand for high thermal conductivity in applications continues to increase, but the contradiction of "high filler leads to high viscosity and processing difficulties" always exists.How to maintain good fluidity while improving thermal conductivity.It has become a key issue in the thermal material industry.

01Core Advantages

Meeting multiple requirements of thermal conductivity, process compatibility, stability and reliability, and global compliance.

1High thermal conductivity efficiency"—— Relies on high loading of thermally conductive fillers, but can lead to an increase in system viscosity."

2Process Compatibility- Narrow components and complex structures place higher demands on material flowability.

3Long-term reliabilityThe material needs to have good flexibility to withstand vibration and thermal cycling.

Industry competition is gradually shifting from "Single thermal conductivity"towards"Comprehensive AdaptabilityEvolution.

02Asahi Kasei Solutions

DynaDrive™Low-viscosity HDI-based polyisocyanate curing agentWith its low viscosity technology, it provides a new solution for thermal materials:

HDI (Hexamethylene Diisocyanate) ==

[Polyisocyanurate Deron™]

Low viscosity grade (Viscosity representative value @25℃)

· Donide™ TLA-100 (500mPa·s)

·Duonade™ TUL-100 (300mPa·s)

- Donide™ D101 (500 mPa·s)

Low viscosity + High curability

Maintain curing performanceMeanwhile, significantly enhance under appropriate conditions. Liquidity。

Chart: Viscosity Comparison When Adding Thermal Interface Material

Figure: Curing Properties of Low Viscosity Grades (Evaluated in Combination with Commercially Available Acrylic Polyols)

Rich product lineup

Viscosity range coverage300–500 mPa·sMeeting different formulation needs.

03Application value

- New Energy Vehicles:Improving the cooling of power batteries and electronic control modules to enhance safety and lifespan.

・ 5G Communication:The high-frequency operation of base stations and antenna equipment ensures long-term stability.

・ AI Server:The thermal management requirements of high-performance computing chips ensure the efficient operation of data centers.

The competition in thermal materials is entering a new stage: it not only needs to conduct heat, but alsoBalancing craftsmanship, reliability, and compliance.。

Asahi Kasei's DURANEX™ series, withLow viscosityTo help overcome the dilemma of "high filler = high viscosity," it provides industry clients with options that combine performance and processability.

In the evolution of heat dissipation technology, material selection is crucial.

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Asahi kasei duraflex™: Low Viscosity Curing Agent Enhances Thermal Management Material Performance

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