Shenzhen Noda Express Technology Co., Ltd

Welcome to visit, Shenzhen Noda Express Technology Co., Ltd. Official website! Soft board processing capability FPC type: Single-panel, single-sided hollow board, double-panel, double-panel layered board, three-layer---six-layer layered board, soft and hard board Soft board substrate copper foil thickness: 8um 12um 17.5um, 35um 70um Minimum line width / line spacing: 2mil / 2mil Minimum bore diameter: Mechanical drilling 4 mil (0.10mm) The largest finished product size: 500mm X600mm Surface treatment: chemical nickel gold, chemical tin, chemical silver, OSP, electroplated gold finger, tin plating, full plate gold plating Solder mask color: white, black, yellow, red, green, blue HDI process capability HDI type: first-order, second-order, third-order, arbitrary layer interconnection Minimum line width / line spacing: 2mil / 2mil Minimum bore diameter: 8mil (0.20mm) Minimum laser drilling aperture: 3mil (0.075mm) Blind hole depth ratio: 1:1 Surface treatment: chemical immersion gold, immersion tin, immersion silver, full plate gold plating, OSP, lead-free spray tin, hard gold plating, gold finger, etc. Solder mask color: white, black, yellow, red, green, blue High multi-layer board processing capability Number of floors: 36 Material: Ordinary FR4, medium Tg FR4, high Tg FR4, halogen-free sheet, PI material, BT material, PPO, PPE, mixed pressure, high frequency (Roger, Arlon\Taconic, Nelco, Taixing Microwave F4B, Isola...) Minimum line width / line spacing: 2mil / 2mil Minimum bore diameter: 8mil (0.20mm) Maximum thickness to aperture ratio: 16:1 Maximum finished product size: Maximum board size: 23′′* 32′′ (584mm*812mm) Surface treatment process: lead-spray tin, chemical immersion gold, immersion tin, immersion silver, full-plate gold plating, OSP, lead-free spray tin, hard gold plating, gold finger, mixed surface treatment, etc. Solder mask color: white, black, yellow, red, green, matte, blue Special processes: high frequency mixing, back drilling, crimping holes, metal substrates, buried capacitor processes, buried resistor processes, etc.