Introduction to Epoxy Rods
Epoxy resin refers to organic macromolecules containing two or more epoxy groups. With few exceptions, they generally have low relative molecular mass. The molecular structure of epoxy resin is characterized by the presence of reactive epoxy groups within the molecular chain, which can be located at the ends, in the middle, or in a cyclic structure. Due to the presence of reactive epoxy groups in the molecular structure, they can undergo cross-linking reactions with various types of curing agents, forming insoluble and infusible polymers with a three-dimensional network structure.
Epoxy boards are made by bonding fiberglass cloth with epoxy resin through heat and pressure, model 3240. They exhibit high mechanical properties at medium temperatures and stable electrical properties at high temperatures. They are suitable for high insulation structural components used in machinery, electrical, and electronic applications, offering high mechanical and dielectric performance along with good heat and moisture resistance. Heat resistance grade F (155 degrees).
1. Specifications: 3.0 to 100mm
2. Regular specifications: 3.0-50mm
3. Colors: Yellow, Black, Water Green
4. Origin: Domestic, Imported
5. Under high temperature conditions of 180℃, it may undergo thermal deformation. Generally, it should not be heated together with other metals, as it may cause deformation of the metal sheets.
