Absorption Rate Over 35%, 1064nm Infrared Laser Pure Copper Powder for Metal 3D Printing, Asia New Material to Attend TCT

At the TCT Asia show, which will be grandly opened at the Shanghai National Exhibition and Convention Center from March 17 to 19, 2026, Asia New Materials (Beijing) Co., Ltd. (hereinafter referred to as "Asia New Materials") will launch a milestone new product, "Cu-R01 1064nm Infrared Laser Dedicated Pure Copper Powder," at booth 7H103 in Hall 7.1, to users worldwide. 3D Printing will conduct live interviews and reports from the TCT show for three consecutive days, so stay tuned.

The product has successfully increased the laser absorption rate to 35%, with a printed part density of over 98%, overcoming the industry's core challenges of low infrared laser absorption and difficult fabrication of conventional copper powders. It opens up new possibilities for the application of laser powder bed fusion (LPBF) technology in the manufacturing of high-performance copper components.

As a national high-tech enterprise specializing in the research and development of spherical micro and nano metal powders, Asia New Material takes advanced atomization technology as its core, mastering various processes such as electrode induction gas atomization, vacuum induction gas atomization, and plasma ultrasonic atomization, with an annual production capacity of over 600 tons. The products are widely used in high-end manufacturing fields such as additive manufacturing, laser cladding, and powder metallurgy.

Global Debut of New Product, Leading Technological Innovation

At this exhibition, Asia New Materials will showcase three series of pure copper powder products.

Higher - Cu-HC High Conductivity and Thermal Conductivity Pure Copper Powder: Specifically developed for applications pursuing the ultimate in electrical and thermal performance. Its SLM-formed conductivity reaches up to 99.5% IACS, with thermal conductivity breaking through 420 W/(m·K); after heat treatment, the conductivity can even reach 100.1% IACS, with thermal conductivity stabilizing at 405 W/(m·K). By optimizing the vacuum atomization powder manufacturing process, Asia New Materials has precisely controlled the oxygen content to within 60 ppm, far superior to the industry standard (≤500 ppm), ensuring material stability from the source.

Broader - Cu-R01 Infrared Laser Special Pure Copper Powder: Optimized for mainstream 1064nm wavelength laser systems, with increased surface micro-nano wrinkled structures to enhance absorption rate up to 35%, ensuring a more stable printing process and more efficient energy utilization, achieving high-quality formation of complex and precise copper components.

Ultrafine sub-micron/nano spherical copper powder: meet the extreme requirements for material particle size in cutting-edge fields such as micro/nano 3D printing, electronic inks, and advanced catalysis.

Technical Sharing Session (March 17, 13:30 PM)

On the afternoon of the first day of the exhibition, Asia New Materials will hold a special press conference, where technical experts will provide in-depth interpretations.

R&D Journey, Performance Advantages, and Application Prospects of the Cu-R01 New Product

Comprehensive Performance Data and Typical Application Cases of High-Conductivity, High-Thermal-Conductivity Pure Copper Powder

The full-process manufacturing plan, heat treatment technology, and authoritative reports on mechanical, electrical, and thermal conductivity properties for key copper alloy materials (CuCrZr, CuCrNb, CuSn12Ni2, etc.) through additive manufacturing.

Four major material systems, with complete solutions demonstrated on-site

At this exhibition, Asia Materials will systematically showcase a complete material matrix tailored for additive manufacturing.

Pure copper series: including T2 copper, Cu-HC (high conductivity), Cu-HP (high purity ≥99.999%), Cu-ODS (oxide dispersion strengthened), and ultra-fine copper powder, meeting diverse requirements from structural components to functional components.

Copper alloy series: including high-strength, high-conductivity alloys such as CuCrZr and CuCrNb-42; wear-resistant alloys such as CuNi2SiCr; and special alloys including CuNi30, CuSn12Ni2, and CuNi15Sn8—offering a wide range of performance combinations.

Titanium and Titanium Alloy Series: From classic alloys such as TC4 and TC11 to high-temperature titanium alloys including Ti60 and Ti600, as well as intermetallic compounds Ti2AlNb and TiAl4822, and functional material NiTi50 (shape memory alloy), comprehensively covering high-end applications in aerospace, medical implants, and beyond.

Special alloy powders series: such as high-damping material M2052, and refractory metal powders including chromium (Cr), vanadium (V), tungsten-molybdenum (WMo), tungsten-rhenium (WRe), etc., expanding the boundaries of additive manufacturing.

Case physical display, witnessing the fusion of performance and craftsmanship

Notably, Asia New Materials will showcase on-site several end-use products fabricated using its proprietary copper alloy powders for 3D printing, including:

Aerospace field: engine combustor, nozzle and other critical components

High-end industrial and electronic fields: high-efficiency liquid cooling modules, high-current copper busbars, etc.

These physical samples vividly demonstrate how Asia New Material powders are transformed into final products with superior performance through advanced additive manufacturing processes. Its core technology is based on the School of Materials Science and Engineering, Beijing University of Science and Technology, achieving an integrated approach of industry, academia, research, and application.

Pure copper additive manufacturing has long faced the "high reflectivity" challenge—copper exhibits extremely low absorption (typically only 3–5%) of 1064 nm infrared lasers, behaving like a mirror and causing difficulties in forming parts and high energy consumption. Asia New Materials has now launched Cu-R01, an infrared laser-specific pure copper powder featuring a micro-nano wrinkled surface structure that boosts absorption to 35%, enabling high-quality pure copper printing on mainstream infrared laser systems without requiring a switch to green lasers.

The commercial value of this breakthrough lies in the fact that the thousands of existing infrared metal printers will have the opportunity to directly participate in the manufacturing of pure copper parts, without the need for additional equipment investment. For fields such as power electronics, high-end cooling, and aerospace, which have a high demand for copper components, this will undoubtedly significantly lower the technical barriers and equipment costs of pure copper additive manufacturing.

Cracking process challenges from the material end is becoming a new paradigm in the evolution of the additive manufacturing industry chain. When the powder itself possesses "process friendliness," the printing parameter window will be significantly broadened, and the stability of batch production will also be fundamentally guaranteed. The new product launch by Asian New Materials this time is worth close attention from the industry.