Sumitomo Bakelite To Expand Production Capacity In China, Singapore

Sumitomo Bakelite Co., Ltd. (Shinagawa, Tokyo, Japan) will expand its production capacity for advanced semiconductor packaging materials at its facilities in Suzhou, China, and Singapore. Both sites will install new production lines for SUMIKON™ EME Molded Underfill (MUF) materials and compression molding granules.

Demand for advanced semiconductors used in applications such as generative AI and communication satellites is growing rapidly, particularly in China and Southeast Asia. Meanwhile, semiconductor packaging is becoming increasingly dense, thin, and large.

Sumitomo Bakelite’s MUF materials exhibit excellent filling performance in microscopic gaps and low-curvature features. By filling solder joints and encapsulating the entire package in a single molding process, they deliver high reliability and manufacturing efficiency.

The company’s compression-molded granules deliver excellent filling performance even in narrow gaps. By optimizing filler size, resin viscosity, and particle size distribution, they achieve uniform molding and low warpage—even for large panels—thereby enhancing productivity in advanced semiconductor manufacturing. To leverage the advantages of these products and technologies and to respond reliably and promptly to growing demand, Sumitomo Bakelite will expand its production capacity in Suzhou, China, and Singapore.