Founded in 2003, Xinfucheng Electronics Co., Ltd. is located in Shenzhen, in consideration of that high-tech electronics industry boomer.It is a professional manufacturer of probe and test socket.The whole factory covers an area of 2,000 square meters .A assembly line, CNC lathe, electroplating assembly line and complete functional testing equipment.We have the capacity and solutions to complex technical problems, diversified orders, quickturn shipments, stable quality.Customized and manufactured more than tens of thousands of products to meet customers' needs and requirements. Xinfucheng continues to introduce probe manufacturing technologies and diversification.The probe products are developed through continuous research and development, breakthrough, focusing on in widely used for testing high-tech products such as the semiconductor industry, electronics industry and PCB industry.Quality is comparable to that in Europe, the United States, Japan and other countries has received unanimous affirmation and trust from the probe industry and end users. Development path 2003 On August 3, 2003, Shenzhen Xinfucheng Electronics Exhibition and Sales Department was formally established.In the beginning of the establishment, the main sales and distribution of test probes was based in Korea, Japan, Germany and the United States. 2009 The sales department at Xinfucheng Electronics began selling probes/test sockets in large quantities to South China and East China, and the company's output value exceeded 5 million yuan for the first time. 2011 Xinfucheng Electronics Exhibition and Sales Department established an assembly line and began purchasing foreign probe parts in large quantities for assembly and OEM sales. 2016 In 2016, the design and manufacture of the test socket began.It has CNC production line, heat treatment department, electroplating production line, assembly line ... & for to introduce excellent performance management mode. 2017 In 2017, Xinfucheng Company put forward four main policies.Xinfucheng Company formulated the "2017~2019 development plan". Business scope Semiconductor package test pin (BGA Testing Probes) Semiconductor test socket (BGA Testing Socket) PCB printed circuit board test (traditional probes) Inline circuit test.and function (test probes) Coaxial high frequency needle (coaxial probes) High current coaxial needle (High Current Testing Probes) Battery and antenna pin Service industry PCB CPU ram Graphics card CMOS ICT (online test) Test socket assemblies Cameras Mobile SMART WEAR IC Methodology Integrated circuit testing mainly includes design verification in chip design, wafer inspection in wafer manufacturing, and testing of finished products after packaging.Regardless of the stage, two steps must be performed to test the chip's various functional indicators.One is to connect the chip's pins to the tester's function module, and the other is to apply input signals to the chip through the tester and check the chip's performance.Output signals to judge the effectiveness of chip functions and performance indicators.