This product exhibits excellent hydrolysis resistance and disperses well in acetone, methyl ethyl ketone, toluene, dichloromethane, and N,N-dimethylformamide, significantly reducing the likelihood of white spot formation. It is suitable for various applications in epoxy resins, new energy vehicle battery packs, and the electronics industry, such as functional adhesives for electronics, epoxy potting compounds, copper-clad laminates, and flexible circuit boards. It meets the strictest flame retardancy standards.
It can be added independently or combined with other halogen-free flame retardants and inorganic fillers to achieve higher flame retardancy and superior electrical, mechanical, and thermal performance. High-speed stirring after addition ensures optimal dispersion of the flame retardant.
The flame retardant remains stable in pre-mixes without stratification.
It has low water absorption, low dielectric loss, and stable electrical properties.
Technical Specifications |
|
|
Property |
Unit |
Specification |
|
Phosphorus Content |
% (w/w) |
23.3-24.0 |
|
Bulk Density |
g/cm³ |
0.15-0.35 |
|
Moisture (K-F) |
% (w/w) |
≤0.50 |
|
2% Thermal Decomposition Temperature |
°C |
＞300 |
|
Particle Size (D₉₅) |
μm |
≤10.0 |
