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SABIC will focus on showcasing specialty polymers for robust data infrastructure at OFC 2025.
Lianshu Network 2025-03-26 13:55:32
SABIC will participate in the 2025 Optical Fiber Communication (OFC) Conference and Exhibition, with booth number #6244. At this event, the company will focus on showcasing high-performance materials, including ULTEM™ and SILTEM™ resins as well as LNP™ ELCRES™ polycarbonate copolymers, to help customers build a robust and reliable data infrastructure.

A new PEI grade capable of withstanding reflow soldering at up to 260°C

SABIC will also introduce a new EXTEM™ RH resin grade capable of withstanding reflow soldering at 260°C. Its enhanced properties support the mass production of multi-lens array (MLA) used in optical interconnect components and subcomponents. Two EXTEM™ resin demonstrators will be showcased: a single-mode expanded beam connector assembly; and a new process that uses metallization for auto-alignment of the MLA.

"Optimizing the network architecture to cope with the explosive data from AI, cloud, and social and digital media requires infrastructure that can enhance transmission speed, bandwidth capacity, and reliability," said Sergi Monros, Vice President of the Polymer Specialties business at SABIC. "SABIC’s specialty thermoplastics and dedicated design services can help the industry build these infrastructures on a large scale. Our materials enhance the performance, precision, cost-effectiveness, and manufacturability of components ranging from connectors and optical interconnects to wires and cables."

The new EXTEM™ RH1017UCL resin is well-suited for emerging technologies such as onboard and co-packaged optical interconnects. This optically transparent material offers greater design freedom compared to fused quartz and thermoset materials. It can also support increased production and reduce system costs by eliminating secondary operations. This new product outperforms other EXTEM™ grades with better near-infrared (NIR) light transmission, lower moisture absorption, and easier processability.

High-Performance Optical Components

In addition to optical interconnects and transceiver lenses, SABIC will also showcase other data infrastructure applications utilizing thermoplastic materials, including applications for external installations and data centers.

  • The external fiber optic box and splice tray are molded from NORYL™ resin or LNP ELCRES copolymer resin, capable of withstanding harsh outdoor conditions, including extreme heat/cold, impact, and weather.

  • Optical fiber and electrical connectors can benefit from Superflow ULTEM™ resin (enabling thin-wall, miniaturized designs) and ULTEM™ EPR resin that is compatible with chemical plating processes.

  • As a potential alternative to fluoropolymers, SILTEM™ resin helps provide high heat resistance and easy processability in the jackets and insulation of wires and cables.

SABIC will showcase the single-mode expandable beam connector assembly at OFC, which was developed in collaboration with Tyndall National Institute. This application utilizes the new EXTEM™ RH1017UCL material, which supports micro-molding and can withstand reflow soldering up to 260°C according to the JEDEC® protocol.

The EXTEM™ RH1017UCL resin will also be showcased in SABIC's second demonstrator, developed in collaboration with the Chip Integration Technology Center (CITC). It will demonstrate optical alignment of MLA using alternative interconnect technologies.

 

 

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