Expo Recap: Emerging Industries (Part II) | Low-Altitude Economy, AI Computing Power, and Innovative Semiconductor Solutions — How Many Have You Seen?
Against the backdrop of the continuous upsurge in the low-altitude economy
High-performance materials
How to meet the demands of the low-altitude economy
Requirements for "lightweight, high strength, and high dimensional stability"?
Many exhibitors brought to the exhibition
Targeted Innovative Solutions
Adapt to the diverse scenario requirements of low-altitude flight
Covestro
Covestro showcased a flying car developed by its Chinese partner Gaoyu (a brand under the GAC Group) at the exhibition.
Covestro's "polycarbonate front windshield for flying cars" was also showcased at the exhibition.
▲ Image source: Covestro
The windshield of the flying car is made from transparent polycarbonate, leveraging its low density and an ultra-thin structural design to achieve excellent optical performance and impact resistance while reducing the total weight of the windshield by more than 50% compared to traditional inorganic glass solutions.
In addition, the window is made using a thermoplastic process with polycarbonate panels, achieving large curved 3D shapes and special waistline designs that are difficult to form with traditional glass. This not only optimizes the appearance but also further reduces wind resistance.
Evonik exhibited an eVTOL, the Peak Fly V2000CG, at the exhibition. Evonik's ROHACELL® has been successfully applied to the propeller and airframe structure of the Peak Fly V2000CG.
ROHACELL® lightweight foam, with its low weight, high strength, and high-temperature resistance, makes it an ideal core material for sandwich structures in rotor blades, fuselage skins, doors, engine nacelles, and complex curved components.
ROHACELL® can maintain stable performance under high-frequency takeoff and landing, and high dynamic load conditions, helping eVTOL reduce weight, increase range and production efficiency.
Additionally, Evonik has provided a complete portfolio of material solutions for the eVTOL market, including VESTAMID® PA12 three-layer cooling tubing and VESTAKEEP® polyether ether ketone (PEEK).
▲ Photo taken at the Evonik booth at CHINAPLAS 2026 International Plastic Exhibition.
Golden Technology
In the low-altitude economy sector, Kingfa Tech has launched a thermoplastic continuous glass fiber/carbon fiber composite solution, supporting eVTOL structures with extreme lightweight advantages.
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More material solutions related to the low-altitude economy
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▲Wotte showcased drone and aircraft models, demonstrating how lightweight, high-weather-resistant specialty materials enhance flight endurance and environmental adaptability.
▲Consumption drone body. Lightweight, high-strength, and high-toughness; strong environmental tolerance; widely adaptable to manufacturing processes.
Aramid paper is widely used in fields with stringent material performance requirements, such as aerospace, rail transit, low-altitude economy, and military.
▲Plant protection drone. Low water absorption long carbon chain nylon.
High-strength and high-toughness polypropylene self-reinforced sheet materials can be applied to low-altitude aircraft. Integrated structure, high strength and high modulus, impact resistance is better than glass fiber. Lightweight: density <0.9g/cm³, 40% lighter than glass fiber, 67% lighter than aluminum alloy. Fully recyclable, low VOC, non-toxic and harmless.
Carbon fiber reinforced polyamide composite materials can be applied to drone propellers and arm components. The products have excellent impact and drop resistance; outstanding fatigue and creep resistance; high processing accuracy, and can be mass-produced.
PA low density nylon material is applied to the drone housing.
▲PA66 material is used in drone propeller blades
▲ T25 Agricultural Drone Spray Boom Housing
▲Drone Shell
Drone filling cap. PC+PBT alloy series. Flame retardant, transparent, chemical resistant.
Semiconductor
Global chip industry accelerates development
High-Performance Materials
It is becoming a key driver of process advancement.
Regarding the semiconductor field
Numerous exhibitors brought
Semiconductor Industry Materials Solutions
Helping industries advance to higher process nodes
Daicel Group
At this exhibition, Daicel Polymer's booth showcased LAPEROS® LCP suitable for next-generation IC trays and TOPAS® COC for advanced process wafer carriers.
▲ LAPEROS® LCP Showcase
Shisuoke
At the exhibition, Siskon displayed semiconductor industry material solutions, such as high-purity PVDF, Galden series perfluoropolyether cooling fluids, TECNOFLON® FFKM series perfluoroelastomers, and Halar® ECTFE materials.
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▲Halar® ECTFE Semiconductor Exhaust Pipe Coating. FM4922 certified; thick coating performance; extremely high chemical resistance; low FPI (Fire Propagation Index) & SDR (Smoke Density Rating); excellent permeation resistance.
▲Galden® PFPE is a thermal fluid used in the semiconductor and consumer electronics industries. Features: wide boiling point range; excellent material compatibility; low evaporation loss; outstanding thermal and chemical stability.
▲ Tecnoflon® FFKM NFS O-rings for sealing applications. Fluorosurfactant-free perfluoroelastomer; utilizes Solvay’s proprietary Fluorosurfactant-Free (NFS) technology; exceptional chemical and thermal resistance; long service life for contamination-free sealing.
Arkema
Arkema showcased high-performance material solutions for semiconductors.
Kynar® PVDF has high purity, extremely low ion leaching, resistance to chemical corrosion, and stable mechanical properties, and is applied in chemical and ultra-pure water piping systems for semiconductor manufacturing, as well as in cleanroom equipment.
Pebax® permanent antistatic agent is suitable for various resin substrates (including transparent and colored substrates), exhibits no migration, and offers stable performance, providing reliable electrostatic dissipation for semiconductor packaging materials.
Waterton Co.
Waterton's high-purity, low-outgassing material solutions meet the stringent environmental requirements for precision manufacturing in semiconductor equipment components.
▲ WOTLON® PEI features strong metal adhesion and high purity. PVD coatings exhibit exceptional adhesion; ion leaching is ≤ PPB level. Applications: high-end metallic decorative components, high-performance lighting reflectors, and semiconductor wafer carriers.
▲ Photo taken at WOTE Advanced Materials' booth, CHINAPLAS 2026 International Trade Fair for Plastics and Rubber.
LG Chem
▲ Semiconductor Developer & Raw Materials
AI Computing Power
AI large models and high-performance computing are flourishing
As the central hub supporting the efficient operation of the intelligent world
Data Center
How to run stably under high-load conditions?
How to balance heat dissipation and strength?
Let’s take a look at the exhibitors at CHINAPLAS.
What answer was given?
▲ (Data Center) Interconnect System. The memory module connectors, such as DDR DIMM, and PCI-E connectors, are made of Engrail's ultra-high flow high-temperature nylon material.
▲ AI Servers: By providing an integrated solution covering electricity, thermal management, mechanical stability, and craftsmanship, they meet the stringent physical requirements imposed by high computational power and achieve both effective substitution of and performance superiority over traditional materials.
▲AI Server. Unique transparent flame retardant solution, enhancing visibility and meeting high safety requirements; excellent impact resistance and heat resistance performance, meeting the requirements of long-term durability and reliability; diversified sustainable solutions (PCR/RE), helping to achieve high scores in new EPEAT, supporting the circular economy goals of leading brands.
▲LAPEROS® LCP enables next-generation high-speed data servers. The LAPEROS® LCP dielectric control series features precise dielectric constant control, low dissipation factor, and excellent high-temperature performance.
Board-to-board connector. LAPEROS® LCP.
Ultramid® Advanced (PPA) is applied to the motherboard in data centers.
▲ Inverter / Energy Storage / Data Center Cooling Fans. Good dimensional stability; good impact resistance; good strength; good chemical resistance.
▲ Liquid cooling manifold for AI data centers. High strength, excellent dimensional stability; good resistance to chemical coolants; low thermal conductivity, aiding thermal management.
▲ Jinfat Technology’s AI Server High-Speed Connector Solution.
▲ Heat-conductive PPS is applied in power supply cooling modules and liquid cooling housings of AI servers. (Photo source: Napin)
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