Polyplastics Merges into Daicel Group, to Debut with New Brand Identity at CHINAPLAS 2026
Polyplastics, with over half a century of expertise in engineering plastics, has officially merged into the century-old Daicel Group. This integration will fully leverage the strong capabilities of both companies in production and R&D, unlocking boundless possibilities for innovation and application in materials science. The newly integrated Daicel will make its debut at CHINAPLAS 2026 – China International Plastics and Rubber Industry Exhibition.
Core Exhibits
xEV Showcase Area: Key components for new energy vehicles crafted from high-performance materials, along with intelligent safety mobility solutions.
High-speed transmission solution: Low dielectric, high-heat-resistant resin materials suitable for server, high-speed connector and other applications.
Semiconductor Solutions: High-performance materials such as LAPEROS® LCP for next-generation IC trays and TOPAS® COC for advanced wafer carriers.
China Market Exclusive New Materials: AURUM™ TPI Ultra Heat-Resistant Thermoplastic Polyimide, Mitsui Chemicals ARLEN™ PA6T High-Temperature Polyamide.
High-quality life application: Materials that comply with strict safety and hygiene standards for food, drinking water contact, medical equipment, and high-purity industries.
China Premiere – Dedicated LCP 3D Printer: Live demonstration of the Swiss-made Nematx high-performance 3D printer, producing high-strength, high-precision, heat-resistant components using LCP material.
Sustainable Development: Highlight CAFBLO® ocean-degradable bioplastic, new POM products containing partial PCR content, and other low-carbon materials and circular economy solutions, demonstrating the group's commitment to sustainable development.
On-site Interaction: Set up interactive games where visitors can learn more about the new Daicel Group and have a chance to win commemorative gifts.
Technical Sharing Session
Theme: High-Performance Materials Empowering the Development of New Energy Vehicles (Introduction to New Automotive TPI, LCP Materials)
Date and Time: April 23, 2026, 15:20–15:40
Venue: Hall 2.2, Booth J80
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